3D IC Stacking Technology

3D IC Stacking Technology

Banqiu Wu, Ajay Kumar, Sesh Ramaswami
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The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper...

    • Kategorie:
    Self-Help, Relationships & Lifestyle - Relationships
    Rok:
    2011
    Wydawnictwo:
    McGraw-Hill Professional;McGraw-Hill Education
    Język:
    english
    Strony:
    373
    ISBN 10:
    007174195X
    ISBN 13:
    9780071741958
    Plik:
    EPUB, 10.63 MB
    IPFS:
    CID , CID Blake2b
    english, 2011
    Pobranie tej książki jest niedostępne z powodu skargi złożonej przez właściciela praw autorskich

    Beware of he who would deny you access to information, for in his heart he dreams himself your master

    — Pravin Lal

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