Packaging of High Power Semiconductor Lasers

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Packaging of High Power Semiconductor...

Packaging of High Power Semiconductor Lasers

Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu (auth.)

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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Kategorie:

Rok:

2015

Wydanie:

1

Wydawnictwo:

Springer-Verlag New York

Język:

english

Strony:

402

ISBN 10:

1461492637

ISBN 13:

9781461492634

Serie:

Micro- and Opto-Electronic Materials, Structures, and Systems

Plik:

PDF, 22.90 MB

IPFS:

,

english, 2015

Ściągnij (pdf, 22.90 MB)

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